1 publication date: december 2004 sdf00037aem data sheet semiconductor company matsushita electric industrial co., ltd. MN673747 MN673747hl part no. package code no. mlga239-c-1111 lqfp176-p-2424b
MN673747, MN673747hl 2 sdf00037aem MN673747, MN673747hl digital conversion lsi ? overview MN673747, MN673747hl digital conversion ls i converts analog video signal input s of ntsc/pal (y/c, composite video), secam (composite video) and y/ cb/cr (component) signals into itu-r bt .656 format signals (international standard for digital video si gnal transfer) before output. ? feature ? increased y/c separation (2d and 3d) accuracy of 9 bits. ? all processes from a/d conversion to rec. 656 output handled at single fixed clock frequency of 27mhz. ? velocity error/jitter correction used for tbc (time base corrector) ensures accurate time axis correction for the full screen. ? frame synchronizer standardizes input signals. ? all functions achievable using a single exte rnal sdram (16-mbit, 108mhz clock frequency). ? microcontroller buss and i 2 c buss for control buss interface (common usage). ? applications dvd recorders, multimedia pcs, hdd-equi pped products and tv/pdp display units ? block diagram 3d y/c separation color demodu- lation clamp agc acc control filter control y c dd conversion tbc vbi slice frame synchronizer microcontroller register mv, cgms, wss, etc. cpn y cps cpn c rec.656 out rec.656 in ynr cnr microcontroller sdram i/f 16-mbit sdram MN673747, MN673747hl an13310 picture control rec 656 i/f analog ic adc adc dac dac dac adc burst lock dd conversion
MN673747, MN673747hl 3 sdf00037aem unit :mm mlga239-c-1111 unit :mm lqfp176-p-2424b 0.40 0.10 9.00 max 9.00 max r p 15 14 m l k 13 12 11 n j h g f e d c 10 9 8 a b 1 2 3 4 5 6 7 16 t 4-( 1.05) 1.00 max 0.05 max 11.00 0.15 0.625 0.20 11.00 0.15 0.625 0.20 0.325 9.75 0.325 9.75 0.65 m 0.15 0.05 88 89 1.40 0.10 44 0.10 0.10 45 132 133 1 0.15 0.0 5 176 (1.25) 1.70 max seating plane 26.00 0.20 24.00 0.10 (1.00) 0.50 0.20 (1.25) 0.20 0.05 26.00 0.20 24.00 0.10 0 ? to 8 ? 0.50 0.08 m 0.10 mn674747 mn674747hl functions 239-pin, 0.65 mm-pitch 11 mm c-csp 176-pin, 0.5 mm-pitch 24 mm lqfp package 3.3 v 0.3 v (analog block) 3.3 v 0.3 v (digital input/output block) 1.8 v 0.15 v (internal digital block) power supply voltage 108.0 mhz max. (27 mhz system clock) operating frequency 0.15 m 4-layer al process itu-r bt.656 1 digital input/output composite signals and y/c, y/cb/cr signals analog input frame synchronization 3d noise reduction, dd conversion, motion-adaptive 3d y/c separation, tbc, ? specifications ? package
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technical information described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. it neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) the products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus- tion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifica- tions satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maximum rat- ing, the range of operating power supply voltage, and heat radiation characteristics. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2003 sep
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